The process took 2 days. I interviewed at SolPad (Raleigh, NC)
Interview
I was interviewed by the CEO and the rest of the team. All what I can say is the CEO is the rudest person who has interviewed me so far. The way he behaved during the interview was so nasty and disgusting! Something is terribly wrong with the management at this company and this is sth that I was kind of expecting before the interview by reading the reviews on glass door !
Interview questions [1]
Question 1
They asked about my background and then some technical questions. A Chinese engineer with a terrible accent asked several questions and I have trouble understanding his accent!!
I applied through a recruiter. The process took 4 weeks. I interviewed at SolPad (New York, NY) in July 2016
Interview
Was contacted by a recruiter and offered an interview over Skype. Asked to substitute Skype with in-person, the panel agreed. Had 2 on-site interviews, one 1-hour long and another 4 hours long, both times with same people. The questions were all over the board from low-level hardware operation to C/C++ to network design. Answered all, better than they expected.
No offer, no explanation.
My guess is -- some of their team members were predisposed not to hire me. They probably had their way over "the good guys". On a second thought, their reported salaries on Glassdoor are below my range, so no worries.
I applied online. The process took 1 day. I interviewed at SolPad (Mountain View, CA) in Jan 2016
Interview
I met with the group in a large conference room. They asked me questions about my background and specific questions about my portfolio. I was challenged to provide solutions to proposed problems. Its a great company, I don't know what they are doing but I am hopping to get a call back with an offer. I was surprised by the quality of the people who work there. They have a lot of technical expertise from a variety of industries, many moved from across the country to work here.
Interview questions [1]
Question 1
They asked very specific questions about materials, documentation, plastics, injection molding, electronics packaging, i.d., surfacing, fea, cfd. It was very comprehensive.